A few days back, MediaTek scheduled an event for January 20 to unveil its latest flagship mobile chipset. This silicon is expected to be the 6nm Dimensity series SoC, which the company teased back in November 2020. Now, ahead of its official announcement, Redmi’s GM has confirmed a smartphone powered by this chip.
Recently, Lu Weibing, the General Manager of Redmi, confirmed the arrival of the Redmi K40 series powered by Qualcomm Snapdragon 888. Listing some key specs, he also revealed that the brand’s latest flagship smartphone series will debut in February.
Earlier today, he surprised his followers on Weibo by confirming another high-end Redmi smartphone powered by the upcoming 6nm MediaTek Dimensity SoC. His post notes that Redmi K30 Ultra featuring MediaTek Dimensity 1000+ has now reached its end of life. Therefore, a new device featuring the latest Dimensity chip will replace it in 2021.
Since he does not mention the specific time period for the launch of this handset, we believe it may only debut in the second half of the year just like the Redmi K30 UltraRedmi K40 and Redmi K40 Pro will be powered by a Qualcomm Snapdragon 700 series chip and Snapdragon 888 SoC.
That said, according to a leak, the forthcoming flagship Dimensity chip will bear the model number MT6893. It will be an octa-core processor built on a 6nm fabrication process. Its CPU will consist of 1 x ARM Cortex-A78 clocked at 3.0GHz, 3 x ARM Cortex-A78 clocked at 2.6GHz, and 4 x ARM Cortex-A55 clocked at 2.0GHz. As for GPU, it will come with ARM Mali-G77 MC9.
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