The realme X9 Pro is a new smartphone from realme that is expected to launch in China soon. The smartphone will be one of the first phones to be powered by the Dimensity 1200 processor, MediaTek’s most powerful mobile chipset. While we wait for a launch date, photos of a special edition of the realme X9 Pro have been posted on the internet.
The photos reported to be those of the realme X9 Pro Master Edition were posted on Weibo by the leaker th at goes by “WHYLAB”. According to him, realme has once again partnered with Naoto Fukasawa for the design of the phone. This is the same designer that has worked with the brand on its previous Master Edition phones.
For the realme X9 Pro Master Edition, the manufacturer is going with the same cement finish used for the 2019 realme X2 Pro Master Edition Cement variant. The device has a curved display, a first for realme, and it has a hole punch at the top left corner. The screen is 6.55 inches in size and has a 90Hz refresh rate.
There are three cameras on the back of the phone and they are stacked vertically in a black housing along with a pill-shaped LED flash. Under the gray-colored back panel is a 4500mAh battery and the phone will have support for 65W fast charging. The leaker also revealed that the phone has a plastic frame and a thickness of 7.8 millimeters.
The realme X9 Pro appears to be the second of two Dimensity 1200 phones realme has planned. The other is the realme GT Neo which it partly unveiled at the launch of the Snapdragon 888-powered realme GT earlier this month. It is unknown which of the two phones will be announced first.
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