Xiaomi is expected to launch the flagship Mi 11 later this month, precisely on December 29 according to rumors. The Mi flagship is expected to launch as the first Snapdragon 888-powered smartphone. Before now, a couple of leaks have emerged giving some hint of what to expect. A new leak has emerged, this time, pictures of the tempered protective glass of the M 11.
The picture which appeared on Weibo shows the device will utilize a curved screen and will have a punch-hole on the top right corner of the display. This is similar to the punch-hole design utilized on the Mi 10, Mi 10 Pro, and Mi 10 Extreme Edition.
Xiaomi had previously confirmed that its third-generation under-screen camera technology will be mass-produced and commercialized in 2021. However, going by this leaked tempered glass, the Mi 11 may likely miss out on this technology.
In terms of core configuration, in addition to the Snapdragon 888 flagship processor, the Mi 11 is also expected to pack 8GB of RAM and have support for 55W fast charging.
It is worth noting that there are reports that the Mi 11 series also has a high-end version, which will feature a Samsung 2K AMOLED screen and have support for a 120Hz refresh rate. The high-end version is also expected to support 120W ultra-fast flash charging.
For the optics, the device will have a triple camera setup on the back along with an LED flashlight. This is horizontally stacked inside a squircle housing. As per the concept renders, the layout will also have a Blue Gradient color with a chamfered bump. The triple-camera array will likely have a 108MP main camera, 13MP ultra-wide, and a 5MP macro sensor.
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