The Asus Zenfone 7 Pro is the company’s latest flagship device, which was recently seen in a new teardown video. This disassembly reveals the smartphone’s internals, revealing the new flip up camera design.
The video was shared on YouTube by PBKreviews, and it showcases the device being taken part. In the video, one can observe that the motor that powers the flip mechanism is housed within the camera module, which is different from the Zenfone 6 that had it’s motor housed next to the camera module and not built into it. Apart from this not a lot of unique design changes have been made on the internals.
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The PCB stack design has also remained unchanged, with two boards being stacked on top of each other. Both boards are cooled via thermal paste and copper, through two heat pipes, which take the heat away from the chipset and into a copper block that has been stuck behind the display. The Asus Zenfone 7 Pro was relatively easy to dismantle for the most part as per the video, but the use of adhesives made things difficult in certain areas.
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